Implement yield improvements to meet set yield objectives. Work with probe, assembly, and final test teams to develop and implement efficient process changes across the factory areas. Work with factory and test engineering teams with responsibility for yield enhancement, cross-factory data management and analysis, new part introduction, process integration, test time reduction, test platform conversion, burn in reduction, data systems and analysis, process tools (GR&R etc) and manufacturability. Drive aggressive cost reductions on existing products through yield improvements, process integration improvements, defect reduction improvements, and product performance improvements. Set up and maintain line control procedures to optimize the product yield and technology performance relative to customer requirements. This position interfaces with Product Engineering, Process Engineering, MBU’s and Global Manufacturing to improve quality, yield, scrap and cost. Technical: BS in Electrical Engineering with preferred Masters Degree. Semiconductor device physics background, ability and experience. Working Knowledge of semiconductor test methodologies for wafer probe and final test. Experience with test platforms and programs. Proficiency with statistics for data analysis. Proficiency with Understanding of test software and process controls Ability to use or quickly learn to use data extraction and analysis tools. Device experience preferred. Non-technical: Both Unix and PC environments. Demonstrated ability to learn, innovate, and work through global teams to accomplish goals Good communication skills, both written and verbal.  

Implement yield improvements to meet set yield objectives. Work with probe, assembly, and final test teams to develop and implement efficient process changes across the factory areas. Work with factory and test engineering teams with responsibility for yield enhancement, cross-factory data management and analysis, new part introduction, process integration, test time reduction, test platform conversion, burn in reduction, data systems and analysis, process tools (GR&R etc) and manufacturability. Drive aggressive cost reductions on existing products through yield improvements, process integration improvements, defect reduction improvements, and product performance improvements. Set up and maintain line control procedures to optimize the product yield and technology performance relative to customer requirements. This position interfaces with Product Engineering, Process Engineering, MBU’s and Global Manufacturing to improve quality, yield, scrap and cost. Technical: BS in Electrical Engineering with preferred Masters Degree. Semiconductor device physics background, ability and experience. Working Knowledge of semiconductor test methodologies for wafer probe and final test. Experience with test platforms and programs. Proficiency with statistics for data analysis. Proficiency with Understanding of test software and process controls Ability to use or quickly learn to use data extraction and analysis tools. Device experience preferred. Non-technical: Both Unix and PC environments. Demonstrated ability to learn, innovate, and work through global teams to accomplish goals Good communication skills, both written and verbal.  

Implement and manage activities to drive yield improvements, test time reduction, and burn in reduction in Final Test. Work with factory and test engineering teams with responsibility for yield enhancement, cross-factory data management and analysis, new part introduction, process integration, test time reduction, test platform conversion, burn in reduction, data systems and analysis, process tools (GR&R etc) and manufacturability. Drive aggressive cost reductions on existing products through yield improvements, process integration improvements, defect reduction improvements, and product performance improvements. Develop and manage Set up and maintain line control procedures to optimize the product yield and technology performance relative to customer requirements. This position interfaces with Product Engineering, Device Engineering, Process Engineering, MBU’s and Global Manufacturing to improve quality, yield, scrap, asset utilization, andTechnical: BS in Electrical Engineering with preferred Masters Degree. Semiconductor device physics background, ability and experience. Working Knowledge of semiconductor test methodologies for wafer probe and final test. Experience with test platforms and programs. Proficiency with statistics for data analysis. Proficiency with both Unix and PC environments. Understanding of test software, test software tools, and process controls Ability to use or quickly learn to use data extraction and analysis tools. Device experience preferred. Non-technical: Demonstrated ability to learn, innovate, and work through global teams to accomplish goals Good communication skills, both written and verbal.  

The responsibilities for this position include: creating product datasheets, performing silicon validation, creating eval boards, writing application notes, support internal or external customers for wining design-wins and training customers. The candidates are expected to have a degree in electrical engineering, deep understanding of analog electronic theory, good written and verbal English skills and communication skills. Having power electronics experience is a plus. 

1、举止大方、谈吐自然，为人正直，有责任心； 2、诚恳，勤奋，好学，尊重人，具有团队合作精神； 3、具有面对问题的积极态度，面对客户的服务热情； 4、熟练的办公软件操作能力。 有开发工厂客户能力者，优先录取！ 基本工资+提成+年终奖 有意者来电：83745273/77/95-1826联系黄先生，确定面试时间！