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| NO.20-AMPD Package Engineering |
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工作性质：全职 |
工作地点：天津市 |
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发布日期：2007-6-26 |
截止日期：2008-6-21 |
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招聘人数：1 |
薪水：面议 |
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工作经验：5 |
学历：本科 |
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语言能力：英语 |
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| 职位描述及其他要求 |
Responsible for Package Engineering for multiple new products for the Automotive Analog and Power Management and Motor Control Operations in the Analog and Mixed Signal Power Division, part of Transportation and Standard Products Group at xxx.
Responsibilities/Expectations include:
Responsible for defining and qualifying the IC package design and assembly process solutions (including subcon selection) for new products
Work with and Lead cross-functional teams (Marketing, Design, Applications, Product, Test and Manufacturing) in the definition, development, qualification, and launch of new products.
Effectively plan and execute projects to ensure key deliverables are met per the project technical, schedule, resource, and financial requirements.
Responsible for tracking and updating the project schedules/ roadmaps, managing issues and risks, communicating project status to management, stakeholders, project team and customer.
Be resourceful in problem solving and providing excellent support to internal customers - such as design teams.
Responsible for Continuously learning and leading evaluation/ develpment of new technologies that meet emerging needs.
BSME or equivalent degree
PMP certification preferred
5+ Years Semiconductor Industry Experience which includes Technical Experience in wirebond package technology design, development and qualification.
3+ Years Program Management Experience including managing complex technical projects
Six Sigma certification preferred. Problem solving skills a must.
Strong leadership and team building skills
Strong interpersonal and communication skills
Good decision making / problem solving skills
Critical thinking skills
Proficient in risk and issue management
Ability to challenge decisions when needed
New product introduction experience
MS Office and MS Project experience
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