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| NO.20-Manufacturing Device Engineer |
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工作性质：全职 |
工作地点：天津市 |
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发布日期：2007-6-26 |
截止日期：2008-7-26 |
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招聘人数：1 |
薪水：面议 |
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工作经验：3 |
学历：本科 |
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语言能力：英语 |
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| 职位描述及其他要求 |
Implement yield improvements to meet set yield objectives.
Work with probe, assembly, and final test teams to develop and implement efficient process changes across the factory areas.
Work with factory and test engineering teams with responsibility for yield enhancement, cross-factory data management and analysis, new part introduction, process integration, test time reduction, test platform conversion, burn in reduction, data systems and analysis, process tools (GR&R etc) and manufacturability.
Drive aggressive cost reductions on existing products through yield improvements, process integration improvements, defect reduction improvements, and product performance improvements.
Set up and maintain line control procedures to optimize the product yield and technology performance relative to customer requirements.
This position interfaces with Product Engineering, Process Engineering, MBU’s and Global Manufacturing to improve quality, yield, scrap and cost.
Technical:
BS in Electrical Engineering with preferred Masters Degree.
Semiconductor device physics background, ability and experience.
Working Knowledge of semiconductor test methodologies for wafer probe and final test.
Experience with test platforms and programs.
Proficiency with statistics for data analysis.
Proficiency with Understanding of test software and process controls
Ability to use or quickly learn to use data extraction and analysis tools.
Device experience preferred.
Non-technical:
Both Unix and PC environments.
Demonstrated ability to learn, innovate, and work through global teams to accomplish goals
Good communication skills, both written and verbal.
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