| 简介 |
TI公司的TMS320F28xx和F28xxx数字信号控制器(DSC)具有较高的32位CPU性能(CPU时钟高达150MHz)和集成了很多高速的外设,能直接连接到板内的ADC的模拟信号.内核电压1.9V,I/O电压3.3V.本文介绍了TMS320F28xx和F28xxx的主要性能,方框图以北及硬件特性, 典型的TMS320F28xx/28xxx系统框图和详细的TMS320F28xx/28xxx硬件设计电路图.
TMS320F2833x, TMS320F2823x DSCs Digital signal processing (DSP) devices currently have higher CPU performance (clock rates over 100 MHz) and integration of advanced high-speed peripherals. Great strides have been made in DSP power reduction through CMOS process technology. These advances have increased the complexity of the DSP board design, which provide more analog challenges than a simple digital design. Some of the examples of these challenges are: board traces can become transmission lines, floating unused device pins can consume unnecessary power, and different core and input/output (I/O) voltages need power management techniques.
The TMS320F28xx and TMS320F28xxx are members of the C2000™ DSP generation used for embedded control applications. The current products run at a CPU frequency up to 150 MHz; future devices in the family may push this frequency upwards. The CPU frequencies of these devices fall in the radio frequency range. There is also a need to create a design that is debug friendly. How can designers access pins on the Ball Grid Array (BGA) packages? What can system designers do at the design stage to help isolate pieces of the board for debug? And even after the board design is completed, there is a need to have a methodical approach for system debug TMS320F28xx/F28xxx devices include various onboard peripheral blocks. Though these peripherals save adding external interface parts and make it flexible to meet the system level requirements for different applications, it is challenging to design the hardware to operate all these peripherals and the DSC to achieve the highest performance with optimum reliability. Therefore, designing a custom board, which should work as desired on the first attempt, is a real challenge. With the CPU frequency up to 150 MHz, there are many internal functional blocks onboard operating at various frequencies. Any signal above 10 MHz can create a signal integrity issue if proper care is not taken during schematics and layout design. In addition, there are low-level analog signals on the same board. EMI/EMC and electrical noise issues should be considered before starting the board design.
TMS320F28xx主要特性:
High-Performance Static CMOS Technology Up to 150 MHz (6.67-ns Cycle Time) 1.9-V Core, 3.3-V I/O Design High-Performance 32-Bit CPU (TMS320C28x) IEEE-754 Single-Precision Floating-Point Unit (FPU) 16 x 16 and 32 x 32 MAC Operations 16 x 16 Dual MAC Harvard Bus Architecture Fast Interrupt Response and Processing Unified Memory Programming Model Code-Efficient (in C/C++ and Assembly) Six Channel DMA Controller (for ADC, McBSP, XINTF, and SARAM) 16-bit or 32-bit External Memory Interface (XINTF) Over 2M x 16 Address Reach On-Chip Memory F28335/F28235: 256K x 16 Flash, 34K x 16 SARAM F28334/F28234: 128K x 16 Flash, 34K x 16 SARAM F28332/F28233: 64K x 16 Flash, 26K x 16 SARAM 1K x 16 OTP ROM Boot ROM (8K x 16) With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O) Standard Math Tables Clock and System Control Dynamic PLL Ratio Changes Supported On-Chip Oscillator Watchdog Timer Module GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts 128-Bit Security Key/Lock Protects Flash/OTP/RAM Blocks Prevents Firmware Reverse Engineering Enhanced Control Peripherals Up to 18 PWM Outputs Up to 6 HRPWM Outputs With 150 ps MEP Resolution Up to 6 Event Capture Inputs Up to 2 Quadrature Encoder Interfaces Up to 8 32-bit/Six 16-bit Timers Three 32-Bit CPU Timers Serial Port Peripherals Up to 2 CAN Modules Up to 3 SCI (UART) Modules Up to 2 McBSP Modules (Configurable as SPI) One SPI Module One Inter-Integrated-Circuit (I2C) Bus 12-Bit ADC, 16 Channels 80-ns Conversion Rate 2 x 8 Channel Input Multiplexer Two Sample-and-Hold Single/Simultaneous Conversions Internal or External Reference Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering JTAG Boundary Scan Support (1) Advanced Emulation Features Analysis and Breakpoint Functions Real-Time Debug via Hardware Development Support Includes ANSI C/C++ Compiler/Assembler/Linker Code Composer Studio IDE DSP/BIOS Digital Motor Control and Digital Power Software Libraries Low-Power Modes and Power Savings IDLE, STANDBY, HALT Modes Supported Disable Individual Peripheral Clocks Package Options Lead-free Green Packaging Thin Quad Flatpack (PGF) MicroStar BGA (ZHH) Plastic BGA (ZJZ) Temperature Options: A: -40°C to 85°C (PGF, ZHH, ZJZ) S: -40°C to 125°C (ZJZ)

图1. TMS320F28xx方框图 F2833x 硬件特性:


图2.典型的TMS320F28xx/28xxx系统框图

图3. TMS320F28xx/28xxx硬件设计电路图(1)

图4. TMS320F28xx/28xxx硬件设计电路图(2)

图5. TMS320F28xx/28xxx硬件设计电路图(3) |

图6. TMS320F28xx/28xxx硬件设计电路图(4)

图7. TMS320F28xx/28xxx硬件设计电路图(5)

图8. TMS320F28xx/28xxx硬件设计电路图(6)

图9. TMS320F28xx/28xxx硬件设计电路图(7)

图10. TMS320F28xx/28xxx硬件设计电路图(8)

图11. TMS320F28xx/28xxx硬件设计电路图(9)
来源:TI |